The Development and Progress of Multi-Physics Simulation Design for TSV-Based 3D Integrated System

In order to meet the requirements of high performance, miniaturization, low cost, power consumption and multi-function, three-dimensional (3D) integrated technology has gradually become a core technology. With development 3D technology, it been used in imaging sensors, optical microsystems, inertial sensor radio-frequency biological microsystems logic etc. Through silicon via (TSV) is system, which can achieve vertical interconnection between stacked chips. this paper, progress multi-physics simulation design for TSV-based systems are reviewed. Firstly, electrical TSV system presented, including lumped parameters model-based numerical computation design. Secondly, thermal presented based on analytical model or model. Thirdly, co-simulation stress electron coupling Finally, paper concluded, future perspectives advanced crossed reconfigurable architecture standardized intelligent